Thermo-Piezoelectric FEM: From Deriving Full Governing Equations to Matrix Formulation

Piezoelectric materials are already powerful due to their ability to couple mechanical and electrical fields — but when we add temperature into the mix, we unlock a new class of materials: thermo-piezoelectric systems. These systems are at the heart of smart sensors, actuators, and energy harvesting technologies, especially in thermally sensitive or high-temperature environments.

In this post, we derive the complete governing equations for thermo-piezoelectric solids by treating displacement, voltage, and temperature as full-fledged, coupled field variables. This sets the foundation for building multiphysics FEM solvers, PINNs, or hybrid approaches.

1. Field Variables

Let $\Omega \subset \mathbb{R}^3$ be a solid domain. We define the primary fields of interest:

  • Displacement $\mathbf{u}(x) = [u_1, u_2, u_3]^T$: describes how the solid deforms spatially
  • Voltage $V(x)$: describes the electric potential field inside the material
  • Temperature $T(x)$: describes the thermal distribution across the solid

We assume all fields are static and smooth enough for differentiation.

2. Derived Fields

From the primary fields, we define the quantities that appear in the constitutive equations:

(a) Strain tensor:

The linear strain tensor (symmetric gradient of displacement):

\[\varepsilon_{ij} = \frac{1}{2} \left( \frac{\partial u_i}{\partial x_j} + \frac{\partial u_j}{\partial x_i} \right)\]

This measures how much the material is stretched or compressed.

(b) Electric field:

The electric field vector is the negative gradient of voltage:

\[E_i = -\frac{\partial V}{\partial x_i}\]

This describes how voltage changes in space and gives rise to internal electrical forces.

(c) Temperature gradient:

Defined as the spatial derivative of the temperature field:

\[\theta_i = \frac{\partial T}{\partial x_i}\]

This gradient drives heat conduction across the material.

3. Constitutive Laws (3-Way Coupling)

We now define how the stress, electric displacement, and heat flux are influenced by the three field variables.

(a) Stress–strain–voltage–temperature relation:

The stress is influenced by:

  • Elastic deformation (via strain)
  • Piezoelectric effect (via electric field)
  • Thermal expansion (via temperature change)
\[\sigma_{ij} = C_{ijkl} \varepsilon_{kl} + e_{kij} \frac{\partial V}{\partial x_k} - \alpha_{ij} (T - T_0)\]

Where:

  • $C_{ijkl}$: elasticity tensor
  • $e_{kij}$: piezoelectric coupling tensor
  • $\alpha_{ij}$: thermal expansion tensor
  • $T_0$: reference temperature (often ambient)

Each term contributes to internal stresses:

  • The first term is mechanical stiffness
  • The second term is the inverse piezoelectric effect
  • The third term is thermal stress

(b) Electric displacement–strain–voltage–temperature relation:

The electric displacement depends on:

  • Mechanical strain (direct piezoelectric effect)
  • Electric field (standard dielectric response)
  • Temperature (pyroelectric effect)
\[D_i = e_{ikl} \varepsilon_{kl} - \varepsilon^S_{ik} \frac{\partial V}{\partial x_k} + p_i (T - T_0)\]

Where:

  • $\varepsilon^S_{ik}$: permittivity tensor (under constant strain)
  • $p_i$: pyroelectric tensor (describes how temperature changes induce polarization)

(c) Heat flux–temperature gradient relation:

Fourier’s law of heat conduction:

\[q_i = -k_{ij} \frac{\partial T}{\partial x_j}\]

Where $k_{ij}$ is the thermal conductivity tensor. This tells us how temperature gradients drive heat flow.

4. Strong Form of Governing Equations

With the above constitutive relations, we now write down the governing PDEs for the coupled system.

(a) Mechanical equilibrium (no body force):

Internal stresses must balance:

\[\frac{\partial \sigma_{ij}}{\partial x_j} = 0\]

Substitute $\sigma_{ij}$:

\[\frac{\partial}{\partial x_j} \left( C_{ijkl} \varepsilon_{kl} + e_{kij} \frac{\partial V}{\partial x_k} - \alpha_{ij} (T - T_0) \right) = 0\]

This equation shows that voltage and temperature both induce internal stress.

(b) Electrical equilibrium (no free charges):

Charge conservation implies:

\[\frac{\partial D_i}{\partial x_i} = 0\]

Substitute $D_i$:

\[\frac{\partial}{\partial x_i} \left( e_{ikl} \varepsilon_{kl} - \varepsilon^S_{ik} \frac{\partial V}{\partial x_k} + p_i (T - T_0) \right) = 0\]

This equation couples the mechanical strain and temperature into the electric field.

(c) Thermal equilibrium (steady-state):

No internal heat sources, steady-state heat conduction:

\[\frac{\partial q_i}{\partial x_i} = 0 \quad \Rightarrow \quad \frac{\partial}{\partial x_i} \left( -k_{ij} \frac{\partial T}{\partial x_j} \right) = 0\]

This equation evolves independently, but temperature affects both stress and electric displacement via the constitutive relations.

We’ve now completed the full set of coupled PDEs for the system, directly from first principles. These equations govern how deformation, voltage, and temperature interact inside a thermo-piezoelectric material.

In the next section, we’ll define the boundary conditions — for displacement, voltage, and temperature — and then derive the weak forms leading to the finite element formulation.

5. Boundary Conditions for Thermo-Piezoelectric Solids

To fully define the coupled PDE system, we need to impose boundary conditions on all three fields:

  • Displacement field $\mathbf{u}$
  • Voltage field $V$
  • Temperature field $T$

Each field supports two types of boundary conditions:

  • Dirichlet (essential): where the field value is prescribed
  • Neumann (natural): where the flux or force associated with the field is prescribed

We denote the boundary of the domain by $\Gamma = \partial \Omega$, and decompose it into appropriate subsets for each condition.

5.1 Displacement Boundary Conditions (Mechanical)

The mechanical field $\mathbf{u}$ supports:

  • Dirichlet BC (Prescribed displacement):

    \[\mathbf{u} = \bar{\mathbf{u}} \quad \text{on } \Gamma_u\]

    This means we are fixing the value of displacement (e.g., clamped or pinned ends).

  • Neumann BC (Prescribed traction):

    \[\boldsymbol{\sigma} \cdot \mathbf{n} = \bar{\mathbf{t}} \quad \text{on } \Gamma_t\]

    This models applied forces or surface pressure. $\mathbf{n}$ is the outward unit normal, and $\bar{\mathbf{t}}$ is the traction vector.

5.2 Voltage Boundary Conditions (Electrical)

The electric potential field $V$ supports:

  • Dirichlet BC (Prescribed voltage):

    \[V = \bar{V} \quad \text{on } \Gamma_V\]

    This is used when you apply a known potential (voltage) on electrodes or surfaces.

  • Neumann BC (Prescribed surface charge or electric flux):

    \[\mathbf{D} \cdot \mathbf{n} = \bar{q} \quad \text{on } \Gamma_q\]

    This models a surface charge density or normal component of electric displacement.

5.3 Temperature Boundary Conditions (Thermal)

The temperature field $T$ supports:

  • Dirichlet BC (Prescribed temperature):

    \[T = \bar{T} \quad \text{on } \Gamma_T\]

    This is used to simulate heating, cooling, or fixed thermal environments.

  • Neumann BC (Prescribed heat flux):

    \[\mathbf{q} \cdot \mathbf{n} = \bar{h} \quad \text{on } \Gamma_h\]

    This represents an external heat input/output — e.g., heating pads, insulation, or convective boundaries.

✅ Summary of Boundary Condition Types

Field Dirichlet (Essential) Neumann (Natural)
Displacement $\mathbf{u} = \bar{\mathbf{u}}$ on $\Gamma_u$ $\boldsymbol{\sigma} \cdot \mathbf{n} = \bar{\mathbf{t}}$ on $\Gamma_t$
Voltage $V = \bar{V}$ on $\Gamma_V$ $\mathbf{D} \cdot \mathbf{n} = \bar{q}$ on $\Gamma_q$
Temperature $T = \bar{T}$ on $\Gamma_T$ $\mathbf{q} \cdot \mathbf{n} = \bar{h}$ on $\Gamma_h$

Each of these boundary conditions will play a role when we derive the weak form of the system, especially the Neumann BCs, which appear naturally as surface integrals.

In the next sections, we’ll derive the weak form of the coupled PDE system — and lay the foundation for the full finite element matrix formulation that handles displacement, voltage, and temperature in one unified framework.

6. Weak Form of the Thermo-Piezoelectric System

We now derive the weak form (variational form) of the governing PDEs from Part 1.

We multiply each PDE by its corresponding test function, integrate over the domain, and use integration by parts to shift derivatives from the field to the test function — this is the standard FEM process that enables numerical discretization.

We define:

  • $\delta \mathbf{u}$ — virtual displacement
  • $\delta V$ — virtual voltage
  • $\delta T$ — virtual temperature

Let’s derive each weak form separately.

6.1 Weak Form: Mechanical Equation

Start with:

\[\int_\Omega \delta u_i \, \frac{\partial \sigma_{ij}}{\partial x_j} \, d\Omega = 0\]

Apply integration by parts:

\[- \int_\Omega \frac{\partial \delta u_i}{\partial x_j} \, \sigma_{ij} \, d\Omega + \int_{\Gamma_t} \delta u_i \, \bar{t}_i \, d\Gamma = 0\]

Now substitute the coupled constitutive law for $\sigma_{ij}$:

\[\sigma_{ij} = C_{ijkl} \varepsilon_{kl} + e_{kij} \frac{\partial V}{\partial x_k} - \alpha_{ij}(T - T_0)\]

Then the weak form becomes:

\[\int_\Omega \frac{\partial \delta u_i}{\partial x_j} \left( C_{ijkl} \varepsilon_{kl} + e_{kij} \frac{\partial V}{\partial x_k} - \alpha_{ij}(T - T_0) \right) d\Omega = \int_{\Gamma_t} \delta u_i \, \bar{t}_i \, d\Gamma\]

This will lead to 3 terms:

  • Elastic stiffness
  • Electromechanical coupling
  • Thermal stress coupling

6.2 Weak Form: Electrical Equation

Start from:

\[\int_\Omega \delta V \, \frac{\partial D_i}{\partial x_i} \, d\Omega = 0\]

Apply integration by parts:

\[- \int_\Omega \frac{\partial \delta V}{\partial x_i} \, D_i \, d\Omega + \int_{\Gamma_q} \delta V \, \bar{q} \, d\Gamma = 0\]

Substitute $D_i$:

\[D_i = e_{ikl} \varepsilon_{kl} - \varepsilon^S_{ik} \frac{\partial V}{\partial x_k} + p_i (T - T_0)\]

Then the weak form becomes:

\[\int_\Omega \frac{\partial \delta V}{\partial x_i} \left( e_{ikl} \varepsilon_{kl} - \varepsilon^S_{ik} \frac{\partial V}{\partial x_k} + p_i (T - T_0) \right) \, d\Omega = \int_{\Gamma_q} \delta V \, \bar{q} \, d\Gamma\]

This introduces:

  • Dielectric energy
  • Piezoelectric coupling
  • Pyroelectric source term

6.3 Weak Form: Thermal Equation

Start with:

\[\int_\Omega \delta T \, \frac{\partial}{\partial x_i} \left(-k_{ij} \frac{\partial T}{\partial x_j} \right) d\Omega = 0\]

Apply integration by parts:

\[\int_\Omega \frac{\partial \delta T}{\partial x_i} \, k_{ij} \frac{\partial T}{\partial x_j} \, d\Omega = \int_{\Gamma_h} \delta T \, \bar{h} \, d\Gamma\]

This is the standard steady-state heat conduction weak form — no coupling appears here explicitly, but temperature influences other fields through constitutive laws.

7. FEM Interpolation and Element Matrices

We now approximate each field using shape functions $N_a(x)$ for node $a$.

7.1 Nodal Field Approximation

For an 8-noded solid element:

  • Displacement: \(\mathbf{u}(x) = \sum_{a=1}^8 N_a(x) \cdot \mathbf{u}_a\)

  • Voltage: \(V(x) = \sum_{a=1}^8 N_a(x) \cdot V_a\)

  • Temperature: \(T(x) = \sum_{a=1}^8 N_a(x) \cdot T_a\)

Each node carries:

  • 3 mechanical DOFs: $u_a$, $v_a$, $w_a$
  • 1 electrical DOF: $V_a$
  • 1 thermal DOF: $T_a$

Total: 5 DOFs per node × 8 nodes = 40 DOFs per element

7.2 B-Matrices for Field Gradients

We define the following matrices:

  • $\mathbf{B}_u$: strain-displacement matrix (6×24)
    Maps nodal displacements to $\varepsilon$

  • $\mathbf{B}_V$: voltage gradient matrix (3×8)
    Maps nodal voltages to electric field: $\mathbf{E} = -\mathbf{B}_V \mathbf{V}_e$

  • $\mathbf{B}_T$: temperature gradient matrix (3×8)
    Maps nodal temperatures to heat flux vector

We’ve now derived the weak forms of the thermo-piezoelectric PDE system and identified the field approximations and gradient matrices needed for FEM.

In the next section, we’ll assemble all the corresponding element matrices — stiffness, coupling, and loading — and present the final 40×40 global system for a single element.

8. Assembling the Final FEM Matrices

Now that we have the weak forms and field interpolations, we are ready to derive the element-level finite element matrices for the coupled thermo-piezoelectric system.

Each 8-noded solid element carries:

  • 3 displacement DOFs per node → $3 \times 8 = 24$
  • 1 voltage DOF per node → $1 \times 8 = 8$
  • 1 temperature DOF per node → $1 \times 8 = 8$

So the total number of DOFs per element is:

\[24 \ (\text{mechanical}) + 8 \ (\text{electrical}) + 8 \ (\text{thermal}) = \boxed{40 \text{ DOFs}}\]

We now define the contributions to each block of the final 40×40 element stiffness matrix.

8.1 Mechanical Stiffness Matrix $\mathbf{K}_{uu}$

Pure mechanical term from strain energy:

\[\boxed{ \mathbf{K}_{uu} = \int_{\Omega^e} \mathbf{B}_u^T \, \mathbf{C} \, \mathbf{B}_u \, d\Omega }\]
  • Size: $24 \times 24$
  • Standard FEM elasticity matrix
  • Includes no coupling yet

8.2 Electromechanical Coupling Matrix $\mathbf{K}_{uV}$

Comes from the inverse piezoelectric effect (voltage → stress):

\[\boxed{ \mathbf{K}_{uV} = \int_{\Omega^e} \mathbf{B}_u^T \, \mathbf{e}^T \, \mathbf{B}_V \, d\Omega }\]

Transpose appears in the electrical equation:

\[\boxed{ \mathbf{K}_{Vu} = \mathbf{K}_{uV}^T }\]
  • Size: $24 \times 8$ and $8 \times 24$
  • Captures how voltage generates mechanical strain and vice versa

8.3 Thermoelastic Coupling Matrix $\mathbf{K}_{uT}$

Thermal strain (temperature → stress):

\[\boxed{ \mathbf{K}_{uT} = - \int_{\Omega^e} \mathbf{B}_u^T \, \boldsymbol{\alpha} \, \mathbf{N}_T \, d\Omega }\]
  • Size: $24 \times 8$
  • Models how thermal expansion affects stress

8.4 Dielectric Matrix $\mathbf{K}_{VV}$

Electric energy storage (pure electrostatics):

\[\boxed{ \mathbf{K}_{VV} = \int_{\Omega^e} \mathbf{B}_V^T \, \boldsymbol{\varepsilon}^S \, \mathbf{B}_V \, d\Omega }\]
  • Size: $8 \times 8$

8.5 Pyroelectric Coupling Matrix $\mathbf{K}_{VT}$

How temperature influences electric displacement:

\[\boxed{ \mathbf{K}_{VT} = \int_{\Omega^e} \mathbf{B}_V^T \, \mathbf{p} \, \mathbf{N}_T \, d\Omega }\]
  • Size: $8 \times 8$
  • Arises from temperature-induced polarization

8.6 Thermal Conductivity Matrix $\mathbf{K}_{TT}$

From steady-state heat conduction:

\[\boxed{ \mathbf{K}_{TT} = \int_{\Omega^e} \mathbf{B}_T^T \, \mathbf{k} \, \mathbf{B}_T \, d\Omega }\]
  • Size: $8 \times 8$

9. Final Coupled Element Matrix (40 × 40 Block Form)

All individual contributions are assembled into one unified block matrix:

\[\begin{bmatrix} \mathbf{K}_{uu} & \mathbf{K}_{uV} & \mathbf{K}_{uT} \\ \mathbf{K}_{Vu} & \mathbf{K}_{VV} & \mathbf{K}_{VT} \\ \mathbf{K}_{Tu} & \mathbf{K}_{TV} & \mathbf{K}_{TT} \end{bmatrix} \begin{Bmatrix} \mathbf{u}_e \\ \mathbf{V}_e \\ \mathbf{T}_e \end{Bmatrix} = \begin{Bmatrix} \mathbf{f}_u \\ \mathbf{f}_V \\ \mathbf{f}_T \end{Bmatrix}\]

Where:

  • $\mathbf{u}_e \in \mathbb{R}^{24}$: displacement vector
  • $\mathbf{V}_e \in \mathbb{R}^{8}$: nodal voltages
  • $\mathbf{T}_e \in \mathbb{R}^{8}$: nodal temperatures

🔍 Notes on Symmetry and Coupling

  • $\mathbf{K}_{uV}$ and $\mathbf{K}_{Vu}$ — are transposes
  • $\mathbf{K}_{uT}$ — is typically non-symmetric (thermal expansion direction matters)
  • $\mathbf{K}_{Tu}$ and $\mathbf{K}_{TV}$ — are often zero in linear analysis, but can be added in nonlinear cases (e.g., temperature-dependent stiffness, Joule heating, etc.)

10. Load Vectors

Each field has its own external loading:

  • $\mathbf{f}_u$: mechanical forces (from traction BCs)
  • $\mathbf{f}_V$: applied charge density
  • $\mathbf{f}_T$: surface or internal heat input

These are computed via:

\[\mathbf{f}_u = \int_{\Gamma_t} \mathbf{N}_u^T \bar{\mathbf{t}} \, d\Gamma\] \[\mathbf{f}_V = \int_{\Gamma_q} \mathbf{N}_V^T \bar{q} \, d\Gamma\] \[\mathbf{f}_T = \int_{\Gamma_h} \mathbf{N}_T^T \bar{h} \, d\Gamma\]

Summary

We’ve now completed the full finite element formulation for a 3-field thermo-piezoelectric solid:

  • 3D displacement
  • Electric potential
  • Temperature

Each physical effect is captured in a clean matrix block, with clear physical meaning and implementation-ready structure.

You can now plug these expressions into an FEM solver or use them as the starting point for building a physics-informed neural network (PINN) model.


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